BERGQUIST GAP FILLER TGF 3500LVO is an ultra-conforming, two-component liquid gap filler designed for sensitive, low-stress applications across aerospace, aviation, defence, OEM, and MRO environments. Its low volatility and excellent wet-out make it suitable for assemblies requiring minimal outgassing and reduced mechanical stress, including avionics, optical systems, cabin electronics, and other mission-critical aerospace applications.

The material provides infinite thickness variability without introducing excess stress to components and cures at room temperature, with the option to accelerate the process using heat. Offering solids with no cure by-products, it supports clean, stable performance in silicone-sensitive environments. With a thermal conductivity of 3.5 W/m-K and exceptional conformability, TGF 3500LVO delivers efficient heat dissipation while protecting delicate electronics.

Key Properties:

• Thermal conductivity: 3.5 W/m-K for effective heat transfer

• Ultra-conforming with excellent wet-out for low-stress interfaces

• Low volatility for outgassing-sensitive or silicone-restricted applications

• solids with no cure by-products

• Room temperature cure with optional heat acceleration

• Suitable for fragile or precision assemblies in aerospace electronics