Cho-Bond 4669 Electrically Conductive Sealant
- 英文名称:Cho-Bond 4669 Electrically Conductive Sealant
- 发布日期: 2018-06-20
- 更新日期: 2025-07-04
产品详请
EINECS编号 |
Cho-Bond 4669 Electrically Conductive Sealant
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品牌 |
PARKER
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英文名称 |
Cho-Bond 4669 Electrically Conductive Sealant
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CAS编号 |
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别名 |
Cho-Bond 4669 Electrically Conductive Sealant
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分子式 |
Cho-Bond 4669 Electrically Conductive Sealant
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CHO-BOND???® 4660 and 4669 ONE COMPONENT FLEXIBLE ELECTRICALLY CONDUCTIVE POLYISOBUTYLENE SEALANT. CHO-BOND 4660 is a silver-plated copper filled, one-component conductive polyisobutylene. It is designed for use as a fillet, gap filler and seam sealant on electrical enclosures for EMI shielding or electrical grounding.